features well defined spatial radiation pattern viewing angle: major axis 120 minor axis 60 high luminous output two red and amber intensity levels: alingap (bright) and alingap ii (brightest) colors: 626/630 nm red 590/592 nm amber526 nm green 470 nm blue superior resistance to moisture uv resistant epoxy benefits viewing angle designed for wide field of view applications superior performance for outdoor environments radiation pattern matched for red, green, and blue for full color sign applications full color signs description these precision optical performance oval leds are specifically designed for full color/video and passenger information signs. the oval shaped radiation pattern (60 x 120 ) and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. these lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. high efficiency led materials are used in these lamps: aluminum indium gallium phosphide (alingap) for red and amber color and indium gallium nitride (ingan) for blue and green. there are two families of red and amber lamps, alingap and the higher performance alingap ii. each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. the package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. designers can select parallel (where the axis of the leads is parallel to the wide axis of the oval radiation pattern) or perpendicular orientation. both lamps are available in tinted version. sunpower series hlmp-rg10, hlmp-sg10, hlmp-rl10, hlmp-sl10, hlmp-rd11, hlmp-sd11, hlmp-rl11, hlmp-sl11, hlmp-rm11, hlmp-sm11, hlmp-rb11, hlmp-sb11 caution: the blue and green leds are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details. hlmp-rg10 4 mm super oval precision optical performance alingap and ingan leds data sheet
2 package dimensions notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. 3. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. device selection guide for alingap color and luminous dominant intensity wavelength i v (mcd) at 20 ma leads with leadframe package part number d (nm) typ. min. max. stand-offs orientation drawing hlmp-sg10-jm000 red 626 240 680 yes perpendicular a hlmp-rg10-jm000 red 626 240 680 yes p arallel b hlmp-sl10-lp0xx amber 590 400 1150 yes perpendicular a hlmp-rl10-lp0xx amber 590 400 1150 yes p arallel b 4.0 ?0.20 (0.157 ?0.008) 1.25 ?0.20 (0.049 ?0.008) 0.80 (0.016) max. epoxy meniscus 9.50 ?0.50 (0.374 ?0.007) 0.44 ?0.20 (0.017 ?0.008) cathode lead a ? 6.30 ?0.20 (0.248 ?0.008) 2.54 ?0.30 (0.100 ?0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ? (0.016 +0.004 ?.000) 0.45 +0.10 ?.04 (0.018 +0.004 ?.002) 4.0 ?0.20 (0.157 ?0.008) 1.25 ?0.20 (0.049 ?0.008) 0.80 (0.016) max. epoxy meniscus 9.50 ?0.50 (0.374 ?0.007) 0.44 ?0.20 (0.017 ?0.008) cathode lead b ? 6.30 ?0.20 (0.248 ?0.008) 2.54 ?0.30 (0.100 ?0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ? (0.016 +0.004 ?.000) 0.45 +0.10 ?.04 (0.018 +0.004 ?.002) dimensions are in millimeters (inches).
3 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. 3. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. device selection guide for alingap ii color and luminous dominant intensity wavelength i v (mcd) at 20 ma leads with leadframe package part number d (nm) typ. min. max. stand-offs orientation drawing hlmp-rd11-j0000 red 630 240 - yes p arallel b hlmp-rd11-lp000 red 630 400 1150 yes p arallel b hlmp-rd11-lpt00 red 630 400 1150 yes p arallel b hlmp-rl11-h0000 amber 592 180 - yes p arallel b hlmp-rl11-lp000 amber 592 400 1150 yes p arallel b hlmp-rl11-lprxx amber 592 400 1150 yes p arallel b hlmp-sd11-j0000 red 630 240 - yes perpendicular a hlmp-sd11-lp000 red 630 400 1150 yes perpendicular a hlmp-sd11-lpt00 red 630 400 1150 yes perpendicular a hlmp-sd11-mn0xx red 630 520 880 yes perpendicular a hlmp-sd11-mntxx red 630 520 880 yes perpendicular a hlmp-sl11-h0000 amber 592 180 - yes perpendicular a hlmp-sl11-hl0xx amber 592 180 520 yes perpendicular a hlmp-sl11-kn0xx amber 592 310 880 yes perpendicular a hlmp-sl11-lp0xx amber 592 400 1150 yes perpendicular a hlmp-sl11-lprxx amber 592 400 1150 yes perpendicular a device selection guide for ingan color and luminous dominant intensity wavelength i v (mcd) at 20 ma leads with leadframe package part number d (nm) typ. min. max. stand-offs orientation drawing hlmp-sm11-lp0xx green 526 400 1150 yes perpendicular a hlmp-rm11-h00xx green 526 180 - yes p arallel b HLMP-RM11-M00XX green 526 520 - yes p arallel b hlmp-sb11-h00xx blue 470 180 - yes perpendicular a hlmp-rb11-d00xx blue 470 65 - yes p arallel b hlmp-rb11-h00xx blue 470 180 - yes p arallel b notes: 4. the luminous intensity is measured on the mechanical axis of the lamp package. 5. the optical axis is closely aligned with the package mechanical axis. 6. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp.
4 part numbering system hlmp - x x xx - xxxxx mechanical options 00: bulk packaging dd: ammo pack yy: flexi-bin; bulk packaging zz: flexi-bin; ammo pack color bin & v f selections 0: no color bin limitation r: amber color bins 1, 2, 4, and 6 with v f maximum of 2.6 v t: red color with v f maximum of 2.6 v maximum intensity bin 0: no iv bin limitation minimum intensity bin refer to device selection guide color b: 470 nm blue d: 630 nm red g: 626 nm red l: 590/592 nm amber m: 526 nm green package r: 4 mm 60?x 120?oval, parallel s: 4 mm 60?x 120?oval, perpendicular absolute maximum ratings t a = 25 c parameter blue and green amber and red dc forward current [1] 30 ma 50 ma peak pulsed forward current 100 ma 100 ma average forward current 30 ma 30 ma reverse voltage (i r = 100 a) 5 v 5 v power dissipation 120 mw 120 mw led junction temperature 130 c 130 c operating temperature range ?0 c to +80 c ?0 c to +100 c storage temperature range ?0 c to +100 c ?0 c to +120 c note: 1. derate linearly as shown in figures 6 and 7.
5 electrical/optical characteristics t a = 25 c parameter symbol min. typ. max. units test conditions typical viewing angle [1] 2 1/2 deg major 120 minor 60 forward voltage v f vi f = 20 ma red ( d = 626 nm) 1.9 2.4 red ( d = 630 nm) 2.0 2.4 [2] amber ( d = 590 nm) 2.02 2.4 amber ( d = 592 nm) 2.15 2.4 [2] blue ( d = 470 nm) 3.5 4.0 green ( d = 526 nm) 3.5 4.0 reverse voltage v r vi r = 100 a amber and red 5 20 blue and green 5 peak wavelength peak nm peak of wavelength of red ( d = 626 nm) 635 spectral distribution red ( d = 630 nm) 639 at i f = 20 ma amber ( d = 590 nm) 592 amber ( d = 592 nm) 594 notes: 1. 2 1/2 is the off-axis angle where the luminous intensity is the on-axis intensity. 2. for options -xxrxx, -xxtxx, and -xxvxx, maximum forward voltage, v f , is 2.6 v. please refer to v f bin table below. 3. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. led indicators parameter symbol min. typ. max. units test conditions blue ( d = 470 nm) 467 green ( d = 526 nm) 524 spectral halfwidth ? 1/2 nm wavelength width at red ( d = 626/630 nm) 17 spectral distribution amber ( d = 590/592 nm) 17 1 / 2 power point at i f = 20 ma blue ( d = 470 nm) 20 green ( d = 526 nm) 35 capacitance c pf v f = 0, f = 1 mhz all colors 40 thermal resistance r j-pin c/ w led junction-to-cathode all colors 240 lead luminous efficacy [3] v lm/w emitted luminous power/ red ( d = 626 nm) 150 emitted radiant power red ( d = 630 nm) 155 amber ( d = 590 nm) 480 amber ( d = 592 nm) 500 blue ( d = 470 nm) 70 green ( d = 526 nm) 540
6 figure 6. amber, red maximum forward current vs. ambient temperature. figure 7. blue, green maximum forward current vs. ambient temperature. figure 1. relative intensity vs. wavelength. figure 2. amber, red forward current vs. forward voltage. figure 4. amber, red relative luminous intensity vs. forward current. figure 3. blue, green forward current vs. forward voltage. figure 5. blue, green relative luminous intensity vs. forward current. wavelength ?nm relative intensity 1.0 0.5 0 600 700 400 650 amber red 550 500 450 blue green 0 40 20 i f ?forward current ?ma v f ?forward voltage ?v 1.0 3.0 amber 1.5 2.0 2.5 10 30 50 red 0 30 15 i f ?forward current v f ?forward voltage 2.0 4.0 2.4 3.2 3.6 5 20 35 2.8 10 25 relative luminous intensity (normalized at 20 ma) 0 0 i f ?forward current ?ma 20 40 2.0 1.0 50 0.5 1.5 2.5 30 10 0 relative luminous intensity (normalized at 20 ma) i f ?forward current ?ma 030 52025 1.5 10 0.5 1.0 15 i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 50 40 30 20 10 20 60 100 r j-a = 585?c/w 60 r j-a = 780?c/w 120 i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 30 20 15 10 5 20 60 100 r j-a = 585?c/w 35 25
7 figure 8b. representative spatial radiation pattern for minor axis. intensity bin limits (mcd at 20 ma) bin name min. max. d6585 e85 110 f 110 140 g 140 180 h 180 240 j 240 310 k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 tolerance for each bin limit is 15%. note: 1. bin categories are established for classification of products. products may not be available in all bin categories. figure 8a. representative spatial radiation pattern for major axis. relative intensity 1.0 0 angular displacement ?degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75 relative intensity 1.0 0 angular displacement ?degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75 bin name min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 tolerance for each bin is 0.05 v. vf bin table [2] blue color range (nm) bin min. max. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 note: 1. all bin categories are established for classification of products. products may not be available in all bin categories. please contact your avago representa- tives for further information. color bin limits (nm at 20 ma) tolerance for each bin limit is 0.5 nm. green color range (nm) bin id min. max. 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 tolerance for each bin limit is 0.5 nm. amber color range (nm) bin id min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 tolerance for each bin limit is 0.5 nm.
precautions lead forming the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions care must be taken during pcb assembly and soldering process to prevent damage to led component. the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. recommended soldering conditions: wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25 c, before handling. special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. recommended pc board plated through hole sizes for led component leads: manual solder w ave soldering dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. led component plated through lead size diagonal hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. figure 9. recommended wave soldering profile. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time ?seconds temperature ? c 60 70 80 90 100 t op side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force. 8
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5989-2793en 5989-4174en may 21, 2006
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